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Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm RO4350B without solder mask

Bicheng Technologies Limited
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    Buy cheap Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm RO4350B without solder mask from wholesalers
     
    Buy cheap Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm RO4350B without solder mask from wholesalers
    • Buy cheap Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm RO4350B without solder mask from wholesalers
    • Buy cheap Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm RO4350B without solder mask from wholesalers
    • Buy cheap Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm RO4350B without solder mask from wholesalers

    Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm RO4350B without solder mask

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    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-002-N0.2
    Certification : UL
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 50000 pieces per month
    Delivery Time : 10 working days
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    Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm RO4350B without solder mask

    Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm

    RO4350B without solder mask

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    RO4350B hydrocarbon ceramic laminates are specially engineered to deliver exceptional high-frequency

    performance while maintaining cost-effective circuit fabrication. As operating frequencies increase beyond

    500 MHz, the selection of suitable laminates for designers becomes limited. However, RO4350B offers the

    necessary properties for designing RF microwave circuits, matching networks, and controlled impedance

    transmission lines.


    Thanks to its low dielectric loss, RO4350B is ideal for applications where higher operating frequencies would

    traditionally limit the use of conventional circuit board materials. This makes it a versatile choice for demanding

    high-frequency environments.



    Temperature Coefficient of Dielectric Constant: RO4350B exhibits one of the lowest coefficients

    of dielectric constant among circuit board materials, ensuring stability over a wide frequency range.


    Thermal Coefficient of Expansion (CTE): The material's CTE offers significant advantages for PCB

    designers. Its expansion coefficient is similar to copper, leading to excellent dimensional stability

    crucial for mixed dielectric multi-layer board constructions.


    Low Z-axis CTE: The low Z-axis CTE of RO4350B ensures reliable plated through-hole quality,

    even under severe thermal shock conditions, enhancing the overall durability of the PCB.


    Glass Transition Temperature (Tg): With a Tg exceeding 280°C, RO4350B maintains stable expansion

    characteristics across the entire range of PCB processing temperatures, contributing to the material's

    reliability and performance during manufacturing processes.


    PCB Specifications

    PCB SIZE93 x 92mm=1PCS
    BOARD TYPE
    Number of LayersDouble sided PCB, 2 Layer PCB
    Surface Mount ComponentsYES
    Through Hole ComponentsYES
    LAYER STACKUPcopper ------- 17.8um(0.5oz)+plate TOP layer
    RO4350B 30mil (0.762mm)
    copper ------- 17.8um(1oz)+plate BOT Layer
    TECHNOLOGY
    Minimum Trace and Space:11.97mil
    Minimum / Maximum Holes:0.3/2.8mm
    Number of Different Holes:2
    Number of Drill Holes:195
    Number of Milled Slots:5
    Number of Internal Cutouts:0
    Impedance ControlNo
    BOARD MATERIAL
    Glass Epoxy:RO4350B 30mil (0.762mm), Tg 288℃
    Final foil external:1oz
    Final foil internal:0oz
    Final height of PCB:0.8mm ±0.1
    PLATING AND COATING
    Surface FinishImmersion Gold (16.2%) 2 micoinch over 100 microinch nickel
    Solder Mask Apply To:NO
    Solder Mask Color:NO
    Solder Mask Type:N/A
    CONTOUR/CUTTINGRouting, Fiducial Marks
    MARKING
    Side of Component LegendNO
    Colour of Component LegendNO
    Manufacturer Name or Logo:N/A
    VIAPlated Through Hole(PTH)
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059" (0.15mm)
    Board plating:0.0030" (0.076mm)
    Drill tolerance:0.002" (0.05mm)
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.

    Typical applications are as follows:

    Automotive Radar and Sensors

    Cellular Base Station Antennas

    Direct Broadcast Satellites

    Low Noise Block

    Power amplifiers

    RFID



    Data sheet of Rogers 4350 (RO4350B)

    RO4350B Typical Value
    PropertyRO4350BDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.48±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.66Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0037
    0.0031
    Z10 GHz/23℃
    2.5 GHz/23℃
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+50Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
    Volume Resistivity1.2 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity5.7 x109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus16,767(2,432)
    14,153(2,053)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength203(29.5)
    130(18.9)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength255
    (37)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.5X,Ymm/m
    (mil/inch)
    after etch+E2/150℃IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion10
    12
    32
    X
    Y
    Z
    ppm/℃-55℃to288℃IPC-TM-650 2.4.41
    Tg>280℃ TMAAIPC-TM-650 2.4.24.3
    Td390℃ TGAASTM D 3850
    Thermal Conductivity0.69W/M/oK80℃ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50℃
    ASTM D 570
    Density1.86gm/cm323℃ASTM D 792
    Copper Peel Stength0.88
    (5.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    Flammability(3)V-0UL 94
    Lead-free Process CompatibleYes

    Quality Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm RO4350B without solder mask for sale
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