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PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness

Bicheng Technologies Limited
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    Buy cheap PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness from wholesalers
     
    Buy cheap PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness from wholesalers
    • Buy cheap PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness from wholesalers
    • Buy cheap PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness from wholesalers
    • Buy cheap PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness from wholesalers

    PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness

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    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-0103-N0.103
    Certification : UL
    Price : USD9.99-99.99
    Payment Terms : T/T/Paypal
    Supply Ability : 50000 pieces per month
    Delivery Time : 10 working days
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    PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness

    PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, 50mil, 60mil,

    with tolerances of 0.6mm for PCB thickness for satellite

    (PCB's are custom-made products, the picture and parameters shown are just for reference)


    Material Composition: Rogers TMM4 is a ceramic, hydrocarbon, thermoset polymer composite tailored

    for high plated-through-hole reliability in stripline and microstrip applications, with a dielectric constant

    of 4.70.


    Benefits: TMM4 amalgamates the advantages of ceramic and traditional PTFE microwave circuit materials,

    without necessitating specialized production techniques. Unlike some materials, it does not need a sodium

    napthanate treatment before electroless plating.


    Thermal Properties: TMM4 boasts an impressively low thermal coefficient of dielectric constant, typically

    below 30 PPM/°C. Its isotropic coefficient of thermal expansion closely mirrors that of copper, enabling

    the creation of dependable plated through-holes and minimal etch shrinkage.


    Thermal Conductivity: The material offers a thermal conductivity roughly double that of conventional PTFE

    /ceramic materials, aiding in effective heat dissipation.


    Thermoset Resins: TMM4, being based on thermoset resins, retains its structural integrity when exposed to

    heat. Consequently, wire bonding of component leads to circuit traces can be conducted without worrying

    about pad lifting or substrate deformation.


    Our PCB Capability (TMM4)

    PCB Material:Composite of Ceramic, hydrocarbon and thermoset polymer
    Designator:TMM4
    Dielectric constant:4.5 ±0.045 (process); 4.7 (design)
    Layer count:1 Layer, 2 Layer
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    Laminate thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP.

    Typical Applications

    Chip testers

    Dielectric polarizers and lenses

    Filters and coupler

    Global Positioning Systems Antennas

    Patch Antennas

    Power amplifiers and combiners

    RF and microwave circuitry

    Satellite communication systems



    Data Sheet of TMM4

    PropertyTMM4DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess4.5±0.045Z10 GHzIPC-TM-650 2.5.5.5
    Dielectric Constant,εDesign4.7--8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor (process)0.002Z-10 GHzIPC-TM-650 2.5.5.5
    Thermal Coefficient of dielectric constant+15-ppm/°K-55℃-125℃IPC-TM-650 2.5.5.5
    Insulation Resistance>2000-GohmC/96/60/95ASTM D257
    Volume Resistivity6 x 108-Mohm.cm-ASTM D257
    Surface Resistivity1 x 109-Mohm-ASTM D257
    Electrical Strength(dielectric strength)371ZV/mil-IPC-TM-650 method 2.5.6.2
    Thermal Properties
    Decompositioin Temperature(Td)425425℃TGA-ASTM D3850
    Coefficient of Thermal Expansion - x16Xppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Y16Yppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Z21Zppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
    Thermal Conductivity0.7ZW/m/K80 ℃ASTM C518
    Mechanical Properties
    Copper Peel Strength after Thermal Stress5.7 (1.0)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
    Flexural Strength (MD/CMD)15.91X,YkpsiAASTM D790
    Flexural Modulus (MD/CMD)1.76X,YMpsiAASTM D790
    Physical Properties
    Moisture Absorption (2X2)1.27mm (0.050")0.07-%D/24/23ASTM D570
    3.18mm (0.125")0.18
    Specific Gravity2.07--AASTM D792
    Specific Heat Capacity0.83-J/g/KACalculated
    Lead-Free Process CompatibleYES----

    Quality PCB for Rogers TMM 4 thermoset microwave material15mil, 20mil, 25mil, 30mil, with tolerances of 0.6mm for PCB thickness for sale
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