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Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas

Bicheng Technologies Limited
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    Buy cheap Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas from wholesalers
     
    Buy cheap Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas from wholesalers
    • Buy cheap Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas from wholesalers
    • Buy cheap Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas from wholesalers
    • Buy cheap Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas from wholesalers

    Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas

    Ask Lasest Price
    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-051-N0.51
    Certification : UL
    Price : USD9.99-99.99
    Payment Terms : T/T/Paypal
    Supply Ability : 50000 pieces per month
    Delivery Time : 10 working days
    • Product Details
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    Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas

    Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased

    Array Antennas

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Rogers RT/duroid 6002 microwave material stands out as a pioneering laminate, offering a unique combination

    of low loss and low dielectric constant properties that are essential for designing intricate microwave structures

    with superior electrical and mechanical characteristics. These features ensure both mechanical reliability and

    electrical stability, crucial in demanding microwave applications.


    Key features and benefits of Rogers RT/duroid 6002 material include:

    1.Thermal Stability: The material exhibits an extremely low thermal coefficient of dielectric constant across a

    wide temperature range from -55°C to +150°C. This stability is vital for applications such as filters, oscillators,

    and delay lines, where precise electrical performance is essential.


    2.Z-Axis Coefficient of Thermal Expansion (CTE): The low Z-axis CTE ensures the reliability of plated through

    holes, contributing to the overall durability and performance of the material in challenging thermal environments.


    3.Reliability: RT/duroid 6002 materials have demonstrated exceptional reliability through temperature cycling

    tests (-55°C to 125°C) for over 5000 cycles without any via failures, highlighting the material's robust construction.


    4.Dimensional Stability: Achieving excellent dimensional stability (0.2 to 0.5 mils/inch) is facilitated by matching

    the coefficient of expansion in the X and Y directions to that of copper. This alignment often eliminates the need

    for double etching, streamlining manufacturing processes and improving positional tolerances.


    5.Reduced Stress on Solder Joints: The low tensile modulus in the X and Y directions reduces stress on solder

    joints, enhancing the overall reliability of surface mount assemblies. The constrained expansion of the laminate,

    coupled with low CTE metal, further enhances surface mount reliability by minimizing mismatch-induced stresses.


    Overall, Rogers RT/duroid 6002 material offers a comprehensive solution for high-frequency applications, combining exceptional electrical properties with mechanical robustness to meet the stringent requirements of modern microwave

    designs.



    The unique properties of RT/duroid 6002 material make it well-suited for a variety of applications that

    require high performance in challenging environments. Some typical applications include:


    Airborne Radar Systems: Utilized in radar systems for aircraft navigation and surveillance applications.


    Beam Forming Networks: Essential for beamforming applications in communication and radar systems.


    Commercial Airline Collision Avoidance: Critical for systems designed to enhance safety and prevent

    collisions in commercial aviation.


    Global Positioning Systems Antennas: Used in GPS antenna systems for accurate positioning and navigation.


    Ground Base Systems: Deployed in ground-based communication and radar systems for various applications.


    High-Reliability Complex Multi-layer Circuits: Ideal for intricate multi-layer circuit designs requiring reliability

    and performance.


    Phased Array Antennas: Employed in phased array antenna systems for communication and radar applications.


    Power Backplanes: Utilized in power distribution systems for efficient and reliable power management in electronic

    devices.


    The exceptional electrical and mechanical properties of RT/duroid 6002 material make it a preferred choice for

    applications such as aerospace designs in hostile environments, where reliability, stability, and high performance

    are paramount. Its suitability for flat and non-planar structures, as well as its compatibility with complex multi-layer

    circuits, further expands its versatility in various high-frequency and microwave applications.


    PCB Specifications

    PCB SIZE78 x 77 mm=1PCS
    BOARD TYPEDouble sided PCB
    Number of Layers2 layers
    Surface Mount ComponentsYES
    Through Hole ComponentsNO
    LAYER STACKUPcopper ------- 35um(1 oz)+plate TOP layer
    RT/duroid 6002 0.254mm
    copper ------- 35um(1 oz)+plate BOT layer
    TECHNOLOGY
    Minimum Trace and Space:10 mil / 10 mil
    Minimum / Maximum Holes:0.3 mm / 0.6 mm
    Number of Different Holes:1
    Number of Drill Holes:2
    Number of Milled Slots:0
    Number of Internal Cutouts:0
    Impedance Control:no
    Number of Gold finger:0
    BOARD MATERIAL
    Glass Epoxy:RT/duroid 6002 0.254mm
    Final foil external:1 oz
    Final foil internal:1 oz
    Final height of PCB:0.3 mm ±0.1
    PLATING AND COATING
    Surface FinishImmersion gold (51.3% ) 0.05µm over 3µm nickel
    Solder Mask Apply To:NO
    Solder Mask Color:NO
    Solder Mask Type:NO
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendN/A
    Colour of Component LegendN/A
    Manufacturer Name or Logo:N/A
    VIAPlated through hole(PTH), minimum size 0.3mm.
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059"
    Board plating:0.0029"
    Drill tolerance:0.002"
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.

    Data Sheet of Rogers 6002 (RT/duroid 6002)

    PropertyRT/duroid 6002DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess2.94±0.04Z10 GHz/23IPC-TM-650 2.5.5.5
    Dielectric Constant,εDesign2.948GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0012Z10 GHz/23IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+12Zppm/10 GHz 0-100IPC-TM-650 2.5.5.5
    Volume Resistivity106ZMohm.cmAASTM D 257
    Surface Resistivity107ZMohmAASTM D 257
    Tensile Modulus828(120)X,YMPa(kpsi)23ASTM D 638
    Ultimate Stress6.9(1.0)X,YMPa(kpsi)
    Ultimate Strain7.3X,Y%
    Compressive Modulus2482(360)ZMPa(kpsi)ASTM D 638
    Moisture Absorption0.02%D48/50IPC-TM-650 2.6.2.1
    ASTM D 570
    Thermal Conductivity0.6W/m/k80ASTM C518
    Coefficient of Thermal Expansion
    (-55 to 288
    )
    16
    16
    24
    X
    Y
    Z
    ppm/23/50% RHIPC-TM-650 2.4.41
    Td500 TGAASTM D 3850
    Density2.1gm/cm3ASTM D 792
    Specific Heat0.93(0.22)j/g/k
    (BTU/ib/
    OF)
    Calculated
    Copper Peel8.9(1.6)Ibs/in.(N/mm)IPC-TM-650 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes


    Quality Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas for sale
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