Sign In | Join Free | My burrillandco.com
Home > Rogers PCB Board >

Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems

Bicheng Technologies Limited
Contact Now
    Buy cheap Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems from wholesalers
     
    Buy cheap Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems from wholesalers
    • Buy cheap Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems from wholesalers
    • Buy cheap Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems from wholesalers

    Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems

    Ask Lasest Price
    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-043-N0.43
    Certification : UL
    Price : USD9.99-99.99
    Payment Terms : T/T/Paypal
    Supply Ability : 50000 pieces per month
    Delivery Time : 10 working days
    • Product Details
    • Company Profile

    Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems

    Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable

    Systems

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for

    reference)


    The Rogers RO3035 high-frequency circuit materials are ceramic-filled PTFE composites developed

    for commercial microwave and RF applications. These materials are designed to offer exceptional

    electrical and mechanical stability at competitive prices, making them ideal for a variety of high

    -frequency applications. The key features and typical applications of RO3035 materials are as

    follows:


    Key Features:
    Consistent Mechanical Properties:
    RO3035 materials provide consistent mechanical properties,

    enabling the design of multi-layer boards without warping or reliability issues.


    Thermal Expansion Properties: The material exhibits a coefficient of thermal expansion (CTE) of

    17 ppm/°C in the X and Y axes, matched to copper. This alignment ensures excellent dimensional

    stability, with minimal etch shrinkage of less than 0.5 mils per inch after etching and baking.


    Z-Axis CTE: With a Z-axis CTE of 24 ppm/°C, RO3035 materials offer exceptional reliability for plated

    through-holes, even in severe environmental conditions.


    Typical Applications:
    Automotive Radar: Used in radar systems for automotive applications.


    Cellular Telecommunications Systems: Employed in cellular network infrastructure.


    Datalink on Cable Systems: Utilized for data transmission in cable systems.


    Direct Broadcast Satellites: Integral in direct satellite communication and broadcasting.


    Global Positioning Satellite Antennas: Essential for GPS antenna systems.


    Patch Antennas for Wireless Communications: Critical for wireless communication systems.


    Power Amplifiers and Antennas: Used in RF power amplification and antenna systems.


    Power Backplanes: Deployed in power distribution systems for efficient power management.


    Remote Meter Readers: Applied in systems for remote data collection and monitoring.


    The versatility and reliability of RO3035 materials make them well-suited for a wide range of high-frequency

    applications, providing excellent electrical properties, mechanical stability, and reliability even in demanding

    environments.



    PCB Specifications

    PCB SIZE140 x 52mm=20PCS
    BOARD TYPEDouble sided PCB
    Number of Layers2 layers
    Surface Mount ComponentsYES
    Through Hole ComponentsYES
    LAYER STACKUPcopper ------- 18um(0.5 oz)+plate TOP layer
    RO3035 0.762mm
    copper ------- 18um(0.5 oz) + plate BOT Layer
    TECHNOLOGY
    Minimum Trace and Space:4 mil / 4 mil
    Minimum / Maximum Holes:0.5 mm / 5.0 mm
    Number of Different Holes:11
    Number of Drill Holes:125
    Number of Milled Slots:0
    Number of Internal Cutouts:0
    Impedance Control:no
    Number of Gold finger:0
    BOARD MATERIAL
    Glass Epoxy:RO3035 0.762mm
    Final foil external:1oz
    Final foil internal:N/A
    Final height of PCB:0.8 mm ±0.1mm
    PLATING AND COATING
    Surface FinishImmersion Gold
    Solder Mask Apply To:N/A
    Solder Mask Color:N/A
    Solder Mask Type:LPSM
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendN/A
    Colour of Component LegendN/A
    Manufacturer Name or Logo:N/A
    VIAPlated through hole(PTH), minimum size 0.5mm.
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059"
    Board plating:0.0029"
    Drill tolerance:0.002"
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.


    Data Sheet of Rogers 3035 (RO3035)

    PropertyRO3035DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.50±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.6Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0015Z10 GHz/23IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-45Zppm/10 GHz -50to 150IPC-TM-650 2.5.5.5
    Dimensional Stability0.11
    0.11
    X
    Y
    mm/mCOND AIPC-TM-650 2.2.4
    Volume Resistivity107MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity107COND AIPC 2.5.17.1
    Tensile Modulus1025
    1006
    X
    Y
    MPa23ASTM D 638
    Moisture Absorption0.04%D48/50IPC-TM-650 2.6.2.1
    Specific Heatj/g/kCalculated
    Thermal Conductivity0.5W/M/K50ASTM D 5470
    Coefficient of Thermal Expansion
    (-55 to 288
    )
    17
    17
    24
    X
    Y
    Z
    ppm/23/50% RHIPC-TM-650 2.4.4.1
    Td500 TGAASTM D 3850
    Density2.1gm/cm323ASTM D 792
    Copper Peel Stength10.2Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes


    Quality Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Bicheng Technologies Limited
    *Subject:
    *Message:
    Characters Remaining: (0/3000)