Dual Layer Rogers PCB Built on 60.7mil RO4350B LoPro Reverse Treated Foil With ENIG for High Speed

Back Planes

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

The RO4350B LoPro laminates leverage a proprietary technology from Rogers that enables the

bonding of reverse treated foil to the standard RO4350B dielectric material. This unique process

yields a laminate characterized by low conductor loss, enhancing insertion loss performance and

signal integrity.

Despite the reduction in conductor loss, the RO4350B LoPro laminate preserves all the other favorable

characteristics of the standard RO4350B system. This innovative approach ensures that the laminate

maintains its integrity and reliability while offering improved signal transmission properties, making it

an ideal choice for high-performance applications where low insertion loss and signal fidelity are critical.

Features and Benefits of RO4350B Laminates:
Material Composition:
RO4350B laminates consist of reinforced hydrocarbon/ceramic materials with a low-profile reverse treated foil,

offering exceptional performance characteristics.

Electrical Performance:

Lower Insertion Loss: Reduced conductor loss translates to lower insertion loss, enhancing signal transmission

efficiency.

Low PIM (Passive Intermodulation): Minimized passive intermodulation distortion ensures cleaner signal output.
Increased Signal Integrity: Improved signal fidelity and reduced signal degradation for reliable data transmission.
High Circuit Density: Enables the design of high-density circuits with optimized performance.

Thermal Properties:

Low Z-Axis Coefficient of Thermal Expansion: Ensures thermal stability and reliability, particularly crucial for temperature-sensitive applications.

Multi-Layer Board Capability: Supports multi-layer board designs, enhancing complexity and functionality.
Design Flexibility: Offers designers the freedom to create intricate circuit layouts and configurations.

Process Compatibility:

Lead-Free Process Compatible: Supports high-temperature processing methods while meeting lead-free

requirements, ensuring compliance with modern manufacturing standards.

High-Temperature Processing: Capable of withstanding high-temperature manufacturing processes without

compromising performance.

Environmental Considerations:

Meets Environmental Concerns: Designed to address environmental regulations and sustainability requirements,

ensuring eco-friendly operation.

CAF Resistant: Resistant to Conductive Anodic Filament (CAF) formation, enhancing the durability and longevity

of the laminate in diverse operating conditions.

RO4350B laminates offer a comprehensive set of features and benefits, combining exceptional electrical performance,

thermal stability, process compatibility, and environmental sustainability, making them a versatile and reliable choice

for a wide range of high-frequency circuit applications.

Our PCB Capability (RO4350B LoPro)

Some Typical Applications:

• Digital applications such as servers, routers, and high speed back planes
• Cellular base station antennas and power amplifiers
• LNB’s for direct broadcast satellites
• RF Identification Tags

Typical Properties of RO4350B LoPro

Established in 2003, Bicheng Technologies Limited is a reputable supplier and exporter of high frequency PCBs based in Hong Kong, China. With 20 years of experience, we specialize in serving global markets in various fields such as cellular base station antennas, satellites, high frequency passive components, microstrip and band line circuits, millimeter wave equipment, radar systems, digital radio frequency antennas, and more.

Our high frequency PCBs primarily utilize materials from renowned brands including Rogers Corporation, Taconic, and Wangling, Shengyi and Zhongying etc. These materials offer a wide range of dielectric constants, ranging from 2.2 to 10.2, ensuring optimal performance for diverse applications.

In addition to high frequency PCBs, we also have dedicated divisions for FR-4 circuit boards, flexible circuits, and metal core PCBs. Our capabilities cover prototype development, small production runs, and large-scale mass production. We actively pursue high-value PCB projects such as HDI (high-density interconnects), quick turnarounds, impedance control, heavy copper, and backplane boards. This comprehensive approach allows us to offer a complete range of PCB products, catering to both low-end and high-end requirements.

Our PCBs find applications in various industries, including computer networking, safety and surveillance systems, power supply units, telecommunication devices, automotive electronics, medical apparatus and instruments, national defense, industrial equipment, and more. We are dedicated to delivering high-quality PCB solutions that meet the diverse needs of our customers.