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High Frequency PCB Built on Taconic RF-60A 60mil 1.5mm Core With Immersion Silver For Power Amplifiers

Bicheng Technologies Limited
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    Buy cheap High Frequency PCB Built on Taconic RF-60A 60mil 1.5mm Core With Immersion Silver For Power Amplifiers from wholesalers
     
    Buy cheap High Frequency PCB Built on Taconic RF-60A 60mil 1.5mm Core With Immersion Silver For Power Amplifiers from wholesalers
    • Buy cheap High Frequency PCB Built on Taconic RF-60A 60mil 1.5mm Core With Immersion Silver For Power Amplifiers from wholesalers
    • Buy cheap High Frequency PCB Built on Taconic RF-60A 60mil 1.5mm Core With Immersion Silver For Power Amplifiers from wholesalers
    • Buy cheap High Frequency PCB Built on Taconic RF-60A 60mil 1.5mm Core With Immersion Silver For Power Amplifiers from wholesalers
    • Buy cheap High Frequency PCB Built on Taconic RF-60A 60mil 1.5mm Core With Immersion Silver For Power Amplifiers from wholesalers
    • Buy cheap High Frequency PCB Built on Taconic RF-60A 60mil 1.5mm Core With Immersion Silver For Power Amplifiers from wholesalers

    High Frequency PCB Built on Taconic RF-60A 60mil 1.5mm Core With Immersion Silver For Power Amplifiers

    Ask Lasest Price
    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-0146-N0.146
    Certification : UL
    Price : USD9.99-99.99
    Payment Terms : T/T/Paypal
    Supply Ability : 50000 pieces per month
    Delivery Time : 10 working days
    • Product Details
    • Company Profile

    High Frequency PCB Built on Taconic RF-60A 60mil 1.5mm Core With Immersion Silver For Power Amplifiers

    High Frequency PCB Built on Taconic RF-60A 60mil 1.5mm Core With Immersion Silver For

    Power Amplifiers

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for

    reference)


    RF-60A is a cutting-edge organic-ceramic laminate within Taconic's ORganic CERamic (ORCER)

    product line, engineered with a foundation of woven glass reinforcement. This innovative material

    represents the culmination of Taconic's proficiency in ceramic fill technology and coated PTFE

    fiberglass. RF-60A boasts remarkable interlaminar bond strength and resistance to solder,

    showcasing its robust construction.


    The proprietary formulation of RF-60A contributes to its outstanding performance attributes,

    including low moisture absorption and consistent electrical properties across the material.

    This unique blend of characteristics makes RF-60A an ideal choice for applications where

    reliability, durability, and precise electrical performance are essential.



    RF-60A's woven glass reinforcement plays a pivotal role in ensuring exceptional dimensional

    stability and bolstering flexural strength, making it a robust choice for demanding applications.

    This reinforcement also contributes to low Z-axis expansion, fostering plated-through-hole

    reliability even in extreme thermal environments.


    Featuring a dielectric constant of approximately 6.15, RF-60A stands out as an ideal high DK

    (dielectric constant) material for applications necessitating compact circuit dimensions and

    reduced weight. Its low electrical loss factor further enhances its suitability for RF circuits,

    ensuring minimal signal degradation and optimal performance in high-frequency applications.

    RF-60A excels in providing a balance of mechanical strength, thermal reliability, and electrical

    performance, making it a versatile solution for a wide range of advanced electronic designs.



    RF-60A laminates adhere fully to RoHS and WEEE directives, ensuring environmental compliance,

    and are designed to meet the temperature requirements associated with lead-free soldering processes.

    Their compatibility with these soldering techniques makes them suitable for modern manufacturing standards.


    These laminates can undergo shearing, drilling, milling, and plating using standard methods applicable

    to PTFE-woven fiberglass materials. This feature streamlines the production process, facilitating mass

    production and enabling efficient manufacturing operations. The versatility and ease of processing of

    RF-60A laminates make them a practical choice for a variety of industrial applications requiring precision

    manufacturing and compliance with environmental regulations.



    Our PCB Capabilities (RF-60A)


    PCB Material:Organic-ceramic Woven Fiberglass Reinforced Laminates
    Designation:RF-60A
    Dielectric constant:6.15 ±0.25
    Dissipation FactorDF 0.0038@10 GHz
    Thermal Conductivity0.4 W/MK
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil (0.254mm), 25mil (0.635mm), 31mil (0.787mm), 50mil (1.27mm), 60mil (1.524mm), 125mil (3.175mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin etc..

    Benefits (in general):

    Low Moisture Absorption

    Stable DK over Frequency

    Dimensionally Stable

    Low Z-axis Expansion

    High Flexural Strength

    Exceptional Interlaminar Bonds


    Typical Applications:

    Power Amplifiers

    Filters & Couplers

    Passive Components

    Antennas


    Data Sheet of Taconic RF-60A


    PropertyTest MethodUnitValueUnitValue
    Dk @ 10 GHzIPC-650 2.5.5.66.156.15
    Df @ 10 GHzIPC-650 2.5.5.5.10.00380.0038
    Moisture AbsorptionIPC-650 2.6.2.1%0.02%0.02
    Dielectric BreakdownIPC-650 2.5.6kV53kV53
    Dielectric StrengthASTM D 149V/mil880kV/mm35
    Volume ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm/cm9.0 x 108Mohm/cm9.0 x 108
    Surface ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm2.28 x 108Mohm2.28 x 108
    Arc ResistanceIPC-650 2.5.1Seconds193Seconds193
    Flexural Strength (MD)ASTM D 790psi18,300N/mm2126.2
    Flexural Strength (CD)ASTM D 790psi14,600N/mm2100.7
    Tensile Strength (MD)ASTM D 3039psi19,500N/mm2134.4
    Tensile Strength (CD)ASTM D 3039psi16,300N/mm2112.4
    Young’s ModulusASTM D 3039kpsi1,590N/mm211,000
    Poisson’s RatioASTM D 30390.068N/mm20.068
    Compressive ModulusASTM D 695 (23°C)kpsi3382,330
    Peel Strength (1 oz. ED)IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)lbs/in8N/mm1.4
    Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.68mm/M0.68
    Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in1.05mm/M1.05
    Density (Specific Gravity)ASTM D 792g/cm32.79g/cm32.79
    Thermal ConductivityASTM F 433W/M*K0.4W/M*K0.4
    CTE (X axis)ASTM D 3386 (-30°C - 125°C)ppm/°C9ppm/°C9
    CTE (Y axis)ASTM D 3386 (-30°C - 125°C)ppm/°C8ppm/°C8
    CTE (Z axis)ASTM D 3386 (-30°C - 125°C)ppm/°C69ppm/°C69
    Outgassing (% TML)ASTM E 595*%0.02%0.02
    Outgassing (% CVCM)ASTM E 595*%0.00%0.00
    Outgassing (% WVR)ASTM E 595*%0.01%0.01
    Flammability RatingUL 94V-0V-0


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